印刷机/Automatic Screen Printer

设备正压/Positive Pressue (Kpa)

0.4~0.6

设备负压/Negative Pressure (-Kpa)

0.1~0.4

设备总功率/Total Power(KW)

2.5kw

硅片厚度 /Wafer Thickness(μm)

100~400

产能/小时(理论值)/Capacity/ hour（theoretical value）

单台印刷机/Singel printer:1100(1200)

双拼印刷机/Double printer:2000(2200)

三拼印刷机: Three layer printer：2800(3100)

印刷精度/Printing Accuracy(mm)

±0.025

运输方式

Transportation

采用弹性皮带运输

Elastic belt transport

运输更平缓,柔和.可以减少类似像卡位骑马式运输硬接触所带来硅片破碎率

Transport steady. Can reduce wafer broken rate arising from transport hard contact.   

刮刀下降方式

Scraper way down

步进马达+气缸

Stepper motor + Cylinder

采用步进马达+气缸方式,无需手动调节刮刀印刷高度,只需在软件里调节,更方便.而且可以根据丝网的张力变化,根据经验值,让刮刀的下降值跟随丝网的变化值,更实用.

Use  stepper motor and cylinder, no need manual adjustment of squeegee  printing height, only adjust on the software, more convenient. According  to changing of screen tension and empirical value, descend value of squeegee will follow screen change, more practical.

印刷方式

Printing

采用双边驱动

Bilateral driver

采用双边龙门式驱动印刷,可以印刷更平稳.

Bilateral gantry type driver printing, more stable.

取像方式

Take photo

采用四相机照取硅片边缘

Take photo for wafer edge  by 4 cameras

采用四相机照取硅片边缘,可以减小硅片尺寸误差所带来印刷偏向问题,从而可以更好地为双印刷提供保证

Take  photo for wafer edge by 4 cameras can avoid printing deviation problem  caused by wafer size error, that could be ensured double printing  effect.

调整方式

Adjustment

平台调整方式,非丝网调整

Platform adjustment mode, non-screen adjustment

调整平台可以更有效地保证栅线印刷的一致性

Adjust platform can ensure consistency of grid line printing effectively.