整机参数/ Machine Specifications:
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设备外形尺寸/Equipment Dimensions (mm)
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WxLxH:800x1400x1600
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设备正压/ Positive Pressue (Kpa)
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0.4~0.6
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设备总功率/Total Power (KW)
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0.5kw
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技术特点/Features:
通过高精度数字相机对硅片摄像后进行图像处理,将已经破损与有缺陷的硅片自动从运输轨道上清除,从而保证进入印刷环节没有不良硅片,减少桨料印刷的损失.而且已经从运输轨道上清除下来的硅片会保存在一固定冶具中,可以非常方便地取出.
检测机还带有缓存硅片的功能,这样就可以尽可能减少其它环节出现故障所带有的产能影响.
同时,检测机还带有翻板功能,需要翻板时则可以使用,不需要时则直接过板,由此可以实现工艺的变更而不需变更产线的设备重新摆放.
Take photo for wafer through high-precision digital camera, then image processing. It can automatic clear broken and defective wafer form conveyor. So can guarantee there is no unqualified wafer in the printing process and reduce printing wastage of glue. And the wafer have been clear from conveyor will keep in fixed jig. It is easy to take out.
Detector is also with cache wafer function. So that can reduce productivity influence caused by go wrong in other process.
Besides, Detector is also with the function of flipping wafer. Can choose flip wafer, if don’t need that pass directly. So it can realize process modifications instead of changing the machine placement.