产品详细
整机参数/ Machine Specifications:
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设备外形尺寸/Equipment Dimensions (mm)
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WxLxH:1000x1300x1600
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设备正压/ Positive Pressue (Kpa)
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0.4~0.6
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设备负压/Negative Pressure (-Kpa)
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0.1~0.4
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设备总功率/Total Power (KW)
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1.5kw
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技术参数/Technical Specifications:
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硅片尺寸/Wafer Size (mm)
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125x125,156x156,210x210
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硅片厚度/Wafer Thickness (μm)
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100~400
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产能/小时/Capacity/ hour
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3000
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印刷精度/Printing Accuracy (mm)
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±0.025
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技术特点/Features:
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具体细项/Item
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控制方式/Control mode
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体现优点/Advantage
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放板方式
Place the board
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整叠硅片放在固定冶具中
Place whole stack of wafer in the jig
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可以一次性放大量硅片,而且无需人为插件或是专门设备进行插件.可以减少人为因素或是设备成本.
Can place a large number of wafers on one-time, no need plug-in by manual mode or plug-in by specialized equipment. Reduce personal factor or equipment cost.
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取板方式
Put out the board
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同步吸取与放置
Absorb and place synchronously
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同步吸取与放置:当一边放置硅片到运输轨道时,另一边同时在吸取硅睡,这样没有浪费中间的控制时间,可以更快速的吸取硅片,提高产能.
When one side place wafer on the conveyor, another side absorb wafer at the same time. Save control time, absorb wafer faster, increase production capacity.
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