田村 TAMURA 低银锡膏GP-217-HF17 衡鹏企业竭诚为您供应
1. Outstanding Features
3) Stable printability and shape of the printed solder paste are obtained with little change in viscosity
during continuous printing.
* Inspected the flux itself only
reduced, furthermore, the environment and the safe workplace are protected. As its flux residue contains no
halides, it can be remained on the PCB without cleaning.
LFSOLDER GP-217-HF17 is a Pb-free and cleaning-free solder paste used Pb-free spherical solder
powder and special flux. Since this solder paste contains no Pb, the usage of hazardous materials is
Table 1 - The characteristics of LFSOLDER GP-217-HF17
1) Pb-free (Sn/Ag/Cu series) alloy solder is used.
2) Excellent wettability for electronic component and land pattern.
4) Excellent solderability is brought with the reflow profile with high peak temperature.
5) Superior reliability is ensured without cleaning the flux residue.
Items Characteristics Test methods
Alloy composition Sn 96.1 / Ag 1.0 / JIS Z 3282 (1999)
Melting point 211??222?? DSC measurement
Particle size of solder 20??36μm Laser diffraction method
Shape of solder powder Spherical Annex 1 to JIS Z 3284 (1994)
Flux content 12.5% JIS Z 3284 (1994)
Chlorine content* 0.0% JIS Z 3197 (1999)
Viscosity 200 Pa??s Annex 6 to JIS Z 3284 (1994)