田村 tamura 低银锡膏GP-216-HF17 衡鹏企业为您供应
LFSOLDER GP-216-HF17 is a Pb-free and cleaning-free
Table 1 Characteristics
Fig.1 SEM photograph of solder powder
solder paste used Pb-free spherical solde powder and
flux. Since this solder paste contains no Pb, the usage of
hazardous materials is reduced, furthermore, the
and the safe workplace are protected. As its flux residue
contains no halides, it can be remained on the PCB
heater and conveyor during reflowing.
temperature.
● Superior reliability is provided by no washing.
● Stable printability with little change in viscosity
?? during continuous printing.
● Pb-free (Sn/Ag/Cu series) solder alloy is used.
● Excellent wettability for electronic component and land p
● Having a good solderability even in air reflow.
● Excellent solderability can be attained for a high peak
2.Outstanding features
cleaning.
Items Characteristics Test methods
Alloy composition Sn96.8/Ag0.3/Cu0.7/Bi2.0/In0.2 JIS Z 3282??1999
Melting point 210??224?? According to DSC
Particle size of
solder powder 20-36μm According to laserdiffraction method
Flux content 12.5% JIS??Z??3284 (1994)
Chlorine content 0.0?? JIS??Z??3197??(1999)
Viscosity 200Pa??s Annex 6 to JIS Z
3284 (1994)